Centre Digital TSE

Séminaires à venir

Yaron Yehezkel (Tel-Aviv University;Coller School of Management), « Competing for Cookies: Platforms’ Business Models in Data Markets with Network Effects », Economics of Platforms Seminar, 3 décembre 2024, 14h00–15h00, Zoom Meeting.

Regina Seibel (Rotman School of Management - University of Toronto), « The Cost of the Cold-Start Problem on Airbnb », Economics of Platforms Seminar, 4 février 2025, 14h00–15h00, Zoom Meeting.

Jay Pil Choi (Michigan State University), « “Sherlocking” and Platform Information Policy », Economics of Platforms Seminar, 4 mars 2025, 14h00–15h00, Zoom Meeting.

Séminaires passés

Devesh Raval ( Harvard Law School), « Steering in One Click: Platform Self-Preferencing in the Amazon Buy Box », Economics of Platforms Seminar, 1 novembre 2022, 14h00–15h00, Zoom Meeting.

Mehmet Ekmekci (Boston College), « Platform Competition and Interoperability: The Net Fee Model », Economics of Platforms Seminar, 4 octobre 2022, 14h00–15h00, Zoom Meeting.

Joel Waldfogel (University of Minnesota and NBER), « GDPR and the Lost Generation of Innovative Apps », Economics of Platforms Seminar, 6 septembre 2022, 14h00–15h00, Zoom Meeting.

Ulrich Laitenberger (Telecom Paris, Institut Polytechnique de Paris), « Bye-box: An Analysis of Non-Promotion on the Amazon Marketplace », Economics of Platforms Seminar, 26 juillet 2022, 14h00–15h00, Zoom Meeting.

Leonardo Madio (University of Padova), « Platform Liability and Innovation », Economics of Platforms Seminar, 12 juillet 2022, 14h00–15h00, Zoom Meeting.

Michael Sockin (University of Texas at Austin), « Decentralization Through Tokenization », Economics of Platforms Seminar, 14 juin 2022, 14h00–15h00, Zoom Meeting.

Meng Liu (Washington University in St. Louis), « Designing Quality Certificates: Insights from eBay », Economics of Platforms Seminar, 31 mai 2022, 14h00–15h00, Zoom Meeting.

Kathryn Spier ( Harvard Law School), « Holding Platforms Liable », Economics of Platforms Seminar, 17 mai 2022, 14h00–15h00, Zoom Meeting.